PCBA Capability

Items	Economic PCB Assembly
Assembly Types	Single sided placement (SMT/Thru-hole)
Layers Count	2,4,6 layers
Thickness	0.8mm – 1.6mm
Single PCB Dimension	10x10mm – 570x470mm
PCB Panel Dimension	10x10mm – 250x250mm
Order Volume	1pc-Unlimited
Surface Finish	Limited by specific options
PCB Color	Limited by specific options
Delivery Format	Single PCB, Panel with mouse bites
Edge Rails	Not necessary
Fiducials	Not necessary
Minimum Package	0402
Minimum IC Pin Spacing	0.4mm
Minimum BGA Spacing	0.5mm
Reflow temperature	255+/-5 °C （not adjustable)
SPI	No
AOI	Yes
Visual Inspection	Yes
X-ray Inspection	Yes
Build time	1 – 3 days

Items	Standard PCB Assembly
Assembly Types	Single & double sided placement (SMT/Thru-hole)
Layers Count	1 – 20 layers
Thickness	0.4mm – 2.0mm
Single PCB Dimension	70x70mm – 510x460mm
PCB Panel Dimension	70x70mm – 250x250mm
Order Volume	1pc-Unlimited
Surface Finish	No limit
PCB Color	No limit
Delivery Format	Single PCB, Panel with mouse bites, Panel with V-cut
Edge Rails	Necessary
Fiducials	Necessary
Minimum Package	0201
Minimum IC Pin Spacing	0.35mm
Minimum BGA Spacing	0.5mm
Reflow temperature	240+/-5 °C
SPI	Yes
AOI	Yes
Visual Inspection	Yes
X-ray Inspection	Yes
Build time	≥ 4 days

Items	Capability	Remarks
BGA	YES	Ball Grid Array
UBGA	YES	Ultra-Fine Ball Grid Array
QFN	YES	Quad Flat Pack No-Lead
QFP	YES	Quad Flat Package
SOIC	YES	Small Outline Integrated Circuit
PLCC	YES	Plastic Leaded Chip Carrier
PoP	YES	Package-On-Package
Small Chip Packages	YES	Pitch of 0.2 mm

Items	Capability	Remarks
Automated Placement Systems	2	With Vision Systems for Inspecting Solder Ball Coverage
Automatic Placement of CBGA	1	With a 3-D laser for Inspecting Solder Ball Height
Automatic Placement of MBGA	1	With a 3-D laser for Inspecting Solder Ball Height
Automatic Placement of PBGA	1	With a 3-D laser for Inspecting Solder Ball Height
Phoenix Real-Time X-Ray System	1	Used for Verification of BGA’s

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