Items | Capability | Remarks |
Layers Number | 1-20 Layers | Copper Layers in the board. |
Controlled Impedance | 4/6 Layers, default layer stack-up. | |
Material | FR-4/Aluminum/Copper Core/Rogers or PTFE Teflon | FR-4: Tg 135 / Tg140 / Tg155 / Tg170 Aluminum thermal conductivity: 1W/m.K Copper core thermal conductivity: 3801W/m.K |
Dielectric constant | 4.5(double-sided PCB) | 7628 Prepreg 4.6 3313 Prepreg 4.05 2116 Prepreg 4.25 |
Max. Dimension | 400x500mm | The maximum dimension in SuperPCBA. |
CNC Routing Dimension Tolerance | ±0.2mm | |
V-scoring Dimension Tolerance | ±0.4mm | |
Board Thickness | 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.5mm | Finished Board Thickness |
Thickness≥1.0mm Tolerance | ± 10% | e.g.If the 2.0mm board thickness, the finished board thickness ranges from 1.8mm(T-1.6×10%) to 2.2mm(T+1.6×10%) |
Thickness<1.0mm) Tolerance | ± 0.1mm | e.g. If the 0.6mm board thickness, the finished board thickness ranges from 0.5mm(T-0.1) to 0.7mm(T+0.1). |
Finished Outer Layer Copper | 1 oz/2 oz (35um/70um) | Finished copper weight of outer layer should be 1oz or 2oz. |
Finished Inner Layer Copper | 0.5 oz (17.5um) | Finished copper weight of inner layer is 0.5oz by default. 2 oz inner copper weight is available for 4-layer PCBs with 1.6mm thickness/JLC3313 stackup/2oz outer copper weight. |
Items | Capability | Remarks |
Drill Hole Size | 0.20mm- 6.30mm | Min. drill size is 0.20mm. Max. drill size is 6.30mm. |
Drill Hole Size Tolerance | +0.13/-0.08mm | If the hole size is0.5mm , the finished hole size will be from 0.42mm to 0.53mm. |
Single&Double Layer PCB Min. Via Hole Size | 0.3mm | |
Multi Layer PCB Min. Via Hole Size | 0.2mm | |
Single&Double Layer PCB Min. Via Diameter | 0.5mm | |
Multi Layer PCB Min. Via Diameter | 0.45mm | Limitation 0.4mm |
PTH hole Size | 0.20mm – 6.35mm | The annular ring size will be enlarged to 0.15mm for production. |
Pad Size | Minimum 1.0mm | The pad size should be enlarged by 0.5mm than the hole size. The minimum size of annular ring around plated through hole pads is 0.25mm. |
Min. Non-plated holes | 0.50mm | The minimum NPTH dimension is 0.50mm, |
NPTH | 0.2mm | NPTH is produced via dry sealing film process, if customer need a NPTH but around with pad/copper, our engineer suggest dig out around pad/copper about 0.2mm-0.25mm. |
Min. Plated Slots | 0.5mm | The minimum plated slot width is 0.5mm, which is drawn with a pad. |
Min. Non-Plated Slots | 1.0mm | Please draw the slot outline in the mechanical layer(GML or GKO) |
Min. Castellated Holes | 0.60mm | |
Hole size Tolerance (Plated) | +0.13mm/-0.08mm | If the Plated hole is 1.00mm, the finished hole size is from 0.92mm to 1.13mm. |
Hole size Tolerance (Non-Plated) | ±0.2mm | If the Non-Plated hole is 1.00mm, the finished hole size is from 0.80mm to 1.20mm. |
Items | Min. Annular Ring | PTH | Remarks |
1oz Copper | 0.13mm | 0.3mm | |
2oz Copper | 0.2mm | 0.3mm |
Items | Capability | Remarks |
Hole to hole clearance | 0.5mm | Different Nets |
Via to Via clearance | 0.254mm | Same Nets |
Pad to Pad clearance | 0.127mm | Pad without hole; Different nets. |
Pad to Pad clearance | 0.5mm | Pad with hole, Different nets |
Via to Track | 0.254mm | |
PTH to Track | 0.33mm | |
NPTH to Track | 0.254mm | |
Pad to Track | 0.2mm |
Items | Min. Trace Width | Remarks |
1-2 Layers | 5mil (0.127mm) | |
4-6 Layers | 3.5mil (0.09mm) | |
2oz Copper weight | 8mil (0.2mm) |
Items | Min. Spacing | Remarks |
1-2 Layers | 5mil (0.127mm) | |
4-6 Layers | 3.5mil (0.09mm) | |
2oz Copper weight | 8mil (0.2mm) |
Items | Min. BGA Pad Dimensions | Min. Distance Between BGA | Remarks |
1/2 layers | 0.25 mm | 0.127mm | |
4/6 layers | 0.25 mm | 0.127mm |
Items | Capablity | Remarks |
Solder Mask Opening/ Expansion | 0.05mm | There should be a minimum of a 0.05 mm “growth/mask opening” around the pad to allow for any mis-registration. |
Green Color Solder Bridge | 0.2mm | To have solder mask bridge, the spacing between copper pads edge must be 0.2mm (8mils) or more. |
Other Colors Solder Bridge | 0.254mm | To have solder mask bridge, the spacing between copper pads edge must be 0.2mm (8mils) or more. |
Solder Mask Color | Green/Red/Yellow/Blue/White/Black. | We use LPI (Liquid Photo Imageable) solder mask. It is the most common type of mask used today. |
Solder Mask Dielectric Constant | 3.8 | |
Solder Mask Ink Thickness | 10-15UM |
Items | Capablity | Remarks |
Minimum Line Width | 6 mil (0.153mm) | Characters width less than 6mil(0.153mm) will be unidentifiable. |
Minimum Text Height | 40 mil (1.0mm) | Characters height less than 40 mil(1.0mm) will be unidentifiable. |
Character Width To Height Ratio | 1:6 | The preferred ratio of width to height is 1:6. |
Hollow-Carved Character Width To Height Ratio | 1:6 | The preferred ratio of width to height is 1:6. |
Pad To Silkscreen | 0.15mm | The Minimum Distance Between Pad and Silkscreen is 0.15mm. |
Items | Capability | Remarks |
Trace To Outline | 0.2mm | Ships as individual board(Rounting):Trace to Outline≥0.2mm. |
Trace to V-Cut Line | 0.4mm | Ship as panel with V-scoring: Trace to V-cut line≥0.4mm. |
Panelization Without Space | 0.0mm | The space between boards is 0.0mm. |
Panelization With Space | 2.0mm | Make sure the space between boards should be ≥2mm,otherwise it will be hard to process for rounding. |
Panelized Round Board | ≥20mmx20mm | The single round board size should be≥20mmx20mm. Panelize with stamp holes and add tooling strips on four board edges |
Panelized Castellated Holes Board | Panelize with stamp holes and add tooling strips on four board edges | The distance between the castellated hole and board corner should be larger than 2mm. Recommended diameter of stamp hole is 0.5mm-0.8mm; Recommended distance between the two stamp holes is 0.2-0.3mm |
Min. Width of Breakaway Tab | 4.0mm | The minimum width of breakaway tab is 4mm. For breakaway with mouse-bites, the minimum width is 5mm. |
Min. Edge Rails | 3.0mm | If choosing panel by JLCPCB, we will add 5mm edge rails on both sides by default. |
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